ATSAMC21E17A-UU
vs
ATSAMC21E17A-AN
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2020-01-31
|
2019-01-14
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
TQFP, TQFP32,.35SQ,32
|
| ECCN Code |
|
3A991.A.2
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
32
|
| Boundary Scan |
|
NO
|
| CPU Family |
|
CORTEX-M0
|
| Clock Frequency-Max |
|
48 MHz
|
| DAC Channels |
|
YES
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-PQFP-G32
|
| Length |
|
7 mm
|
| Low Power Mode |
|
YES
|
| Number of DMA Channels |
|
12
|
| Number of External Interrupts |
|
16
|
| Number of I/O Lines |
|
26
|
| Number of Serial I/Os |
|
5
|
| Number of Terminals |
|
32
|
| Number of Timers |
|
8
|
| On Chip Data RAM Width |
|
8
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TQFP
|
| Package Equivalence Code |
|
TQFP32,.35SQ,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, THIN PROFILE
|
| RAM (words) |
|
16384
|
| ROM (words) |
|
131072
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.2 mm
|
| Speed |
|
48 MHz
|
| Supply Current-Max |
|
2.5 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
|
|
|
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