ATSAMA5D36A-CUR
vs
ATSAMA5D36A-CU
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
LFBGA, BGA324,18X18,32
LFBGA, BGA324,18X18,32
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
4 Weeks
Samacsys Manufacturer
Microchip
Microchip
Address Bus Width
26
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
48 MHz
48 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e1
Length
15 mm
15 mm
Low Power Mode
YES
YES
Number of DMA Channels
39
39
Number of External Interrupts
1
1
Number of Serial I/Os
10
10
Number of Terminals
324
324
On Chip Data RAM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA324,18X18,32
BGA324,18X18,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
131072
131072
Seated Height-Max
1.4 mm
1.4 mm
Speed
536 MHz
536 MHz
Supply Voltage-Max
1.32 V
1.32 V
Supply Voltage-Min
1.08 V
1.08 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2