ATSAM4SD16CB-CFU
vs
ATSAM4SD16CB-CFNR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
VFBGA-100
VFBGA-100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
20 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
8
8
JESD-30 Code
S-PBGA-B100
S-PBGA-B100
Length
7 mm
7 mm
Number of I/O Lines
79
79
Number of Terminals
100
100
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
ROM (words)
1048576
1048576
ROM Programmability
FLASH
FLASH
Seated Height-Max
1 mm
1 mm
Speed
120 MHz
120 MHz
Supply Voltage-Max
1.32 V
1.32 V
Supply Voltage-Min
1.08 V
1.2 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Width
7 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
1
Factory Lead Time
8 Weeks
CPU Family
CORTEX-M4
Format
FIXED POINT
Integrated Cache
YES
JESD-609 Code
e1
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of DMA Channels
22
Number of External Interrupts
79
Number of Serial I/Os
4
Number of Timers
6
On Chip Data RAM Width
8
Package Equivalence Code
BGA100,10X10,25
Peak Reflow Temperature (Cel)
260
RAM (bytes)
163840
Supply Current-Max
25 mA
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
Compare ATSAM4SD16CB-CFU with alternatives
Compare ATSAM4SD16CB-CFNR with alternatives