ATSAM3U1CA-AU
vs
AT90USB1286-16MUR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFP
|
|
| Package Description |
14 X 14 MM, 0.50 MM PITCH, GREEN, MS-026, LQFP-100
|
QFN-64
|
| Pin Count |
100
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
16
|
| Bit Size |
32
|
8
|
| CPU Family |
CORTEX-M3
|
|
| Clock Frequency-Max |
12 MHz
|
16 MHz
|
| DAC Channels |
YES
|
NO
|
| DMA Channels |
YES
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQFP-G100
|
S-XQCC-N64
|
| Length |
14 mm
|
9 mm
|
| Number of I/O Lines |
96
|
48
|
| Number of Terminals |
100
|
64
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
LFQFP
|
HVQCCN
|
| Package Equivalence Code |
QFP100,.63SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
20480
|
|
| ROM (words) |
65536
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
1 mm
|
| Speed |
12 MHz
|
16 MHz
|
| Supply Voltage-Max |
1.95 V
|
5.5 V
|
| Supply Voltage-Min |
1.8 V
|
4.5 V
|
| Supply Voltage-Nom |
1.8 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
ALSO OPERATES AT 8 MHZ AT 2.7V MIN SUPPLY
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare ATSAM3U1CA-AU with alternatives
Compare AT90USB1286-16MUR with alternatives