ATSAM3S1CB-CU
vs
AT91SAM7S256D-MU
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
9 X 9 MM, 1.10 MM HEIGHT, 0.80 MM PITCH, GREEN, TFBGA-100
|
GREEN, MO-220, QFN-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| CPU Family |
CORTEX-M3
|
ARM7
|
| Clock Frequency-Max |
20 MHz
|
50 MHz
|
| DAC Channels |
YES
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
8
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PBGA-B100
|
S-PQCC-N64
|
| JESD-609 Code |
e1
|
|
| Length |
9 mm
|
9 mm
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of DMA Channels |
22
|
|
| Number of External Interrupts |
30
|
|
| Number of I/O Lines |
79
|
32
|
| Number of Serial I/Os |
4
|
|
| Number of Terminals |
100
|
64
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA100,10X10,32
|
LCC64,.35SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
16384
|
65536
|
| ROM (words) |
65536
|
262144
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.1 mm
|
0.9 mm
|
| Speed |
64 MHz
|
55 MHz
|
| Supply Voltage-Max |
1.95 V
|
1.95 V
|
| Supply Voltage-Min |
1.8 V
|
1.65 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare ATSAM3S1CB-CU with alternatives
Compare AT91SAM7S256D-MU with alternatives