ATMEGA8L-8MN
vs
ATMEGA8L-8ANR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
5 X 5 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, MO-220VHHD-2, MLF-32
|
7 X 7 MM, 1 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, MS-026ABA, TQFP-32
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
AVR RISC
|
AVR RISC
|
Clock Frequency-Max |
8 MHz
|
8 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-XQCC-N32
|
S-PQFP-G32
|
Length |
5 mm
|
7 mm
|
Number of I/O Lines |
23
|
23
|
Number of Terminals |
32
|
32
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
TQFP
|
Package Equivalence Code |
LCC32,.2SQ,20
|
TQFP32,.35SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1024
|
1024
|
ROM (words) |
8192
|
8192
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Current-Max |
6 mA
|
6 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
5 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
2
|
1
|
|
|
|
Compare ATMEGA8L-8MN with alternatives
Compare ATMEGA8L-8ANR with alternatives