ATMEGA103L-4AI
vs
ATMEGA128L-8AUR
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TQFP-64
|
TQFP-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
YES
|
| CPU Family |
AVR
|
AVR RISC
|
| Clock Frequency-Max |
4 MHz
|
8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| Length |
14 mm
|
14 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of External Interrupts |
8
|
8
|
| Number of I/O Lines |
32
|
53
|
| Number of Terminals |
64
|
64
|
| Number of Timers |
3
|
4
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
16
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
TQFP
|
| Package Equivalence Code |
TQFP64,.63SQ,32
|
TQFP64,.63SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, THIN PROFILE
|
| RAM (bytes) |
4096
|
4096
|
| ROM (words) |
16384
|
131072
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Speed |
4 MHz
|
8 MHz
|
| Supply Current-Max |
5 mA
|
5.5 mA
|
| Supply Voltage-Max |
3.6 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.31.00.01
|
| Factory Lead Time |
|
8 Weeks
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Number of Serial I/Os |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
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