ATF750C-10JC
vs
ATF750C-10XL
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
Part Package Code |
LCC
|
TSSOP
|
Package Description |
PLASTIC, MS-018AB, LCC-28
|
TSSOP,
|
Pin Count |
28
|
24
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
NO
|
|
Clock Frequency-Max |
83 MHz
|
83 MHz
|
In-System Programmable |
NO
|
|
JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G24
|
JESD-609 Code |
e0
|
e3
|
JTAG BST |
NO
|
|
Length |
11.5062 mm
|
7.8 mm
|
Moisture Sensitivity Level |
2
|
2
|
Number of Dedicated Inputs |
11
|
11
|
Number of I/O Lines |
10
|
10
|
Number of Macro Cells |
10
|
|
Number of Terminals |
28
|
24
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
11 DEDICATED INPUTS, 10 I/O
|
11 DEDICATED INPUTS, 10 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
TSSOP
|
Package Equivalence Code |
LDCC28,.5SQ
|
TSSOP24,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
225
|
260
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
10 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.572 mm
|
1.2 mm
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
11.5062 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare ATF750C-10JC with alternatives
Compare ATF750C-10XL with alternatives