ATF22LV10C-10PU
vs
AT22LV10-25PI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, GREEN, PLASTIC, MS-001AF, DIP-24
|
DIP-24
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
71.4 MHz
|
34.5 MHz
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDIP-T24
|
| JESD-609 Code |
e3
|
|
| Length |
31.877 mm
|
32 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Dedicated Inputs |
10
|
11
|
| Number of I/O Lines |
10
|
10
|
| Number of Inputs |
22
|
22
|
| Number of Outputs |
10
|
10
|
| Number of Product Terms |
132
|
132
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
10 DEDICATED INPUTS, 10 I/O
|
11 DEDICATED INPUTS, 10 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FLASH PLD
|
OT PLD
|
| Propagation Delay |
10 ns
|
25 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.334 mm
|
5.08 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare ATF22LV10C-10PU with alternatives