ATF20V8C-15XI vs PAL16R6A-2CNSTD feature comparison

ATF20V8C-15XI Microchip Technology Inc

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PAL16R6A-2CNSTD AMD

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ADVANCED MICRO DEVICES INC
Package Description TSSOP, TSSOP24,.25 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE
Clock Frequency-Max 45 MHz 16 MHz
JESD-30 Code R-PDSO-G24 R-PDIP-T20
JESD-609 Code e0
Length 7.8 mm 25.908 mm
Moisture Sensitivity Level 2
Number of Dedicated Inputs 11 8
Number of I/O Lines 8 2
Number of Inputs 20
Number of Outputs 8
Number of Product Terms 64
Number of Terminals 24 20
Operating Temperature-Max 85 °C 75 °C
Operating Temperature-Min -40 °C
Organization 11 DEDICATED INPUTS, 8 I/O 8 DEDICATED INPUTS, 2 I/O
Output Function MACROCELL MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Programmable Logic Type EE PLD OT PLD
Propagation Delay 15 ns 35 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3.81 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm 7.62 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 20
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare ATF20V8C-15XI with alternatives

Compare PAL16R6A-2CNSTD with alternatives