ATF20V8B-10GM/883
vs
PALCE20V8H-10PC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
LATTICE SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP24,.3
|
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
|
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
68 MHz
|
66.7 MHz
|
| JESD-30 Code |
R-GDIP-T24
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
32 mm
|
|
| Number of Dedicated Inputs |
12
|
12
|
| Number of I/O Lines |
8
|
8
|
| Number of Inputs |
20
|
20
|
| Number of Outputs |
8
|
8
|
| Number of Product Terms |
64
|
64
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
12 DEDICATED INPUTS, 8 I/O
|
12 DEDICATED INPUTS, 8 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Programmable Logic Type |
FLASH PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
10 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare ATF20V8B-10GM/883 with alternatives