ATECC608B-TNGTLSS-G
vs
SLS32AIA010I2USON10XTMA2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INFINEON TECHNOLOGIES AG
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
7 Weeks
|
20 Weeks
|
| Clock Frequency-Max |
1 MHz
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-N10
|
| JESD-609 Code |
e4
|
e4
|
| Length |
4.9 mm
|
3 mm
|
| Number of Terminals |
8
|
10
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP8,.23
|
SOLCC10,.12,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1.75 mm
|
0.6 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2 V
|
1.62 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3 mm
|
| uPs/uCs/Peripheral ICs Type |
CRYPTOGRAPHIC AUTHENTICATOR
|
CRYPTOGRAPHIC AUTHENTICATOR
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
USON-10
|
| Samacsys Manufacturer |
|
Infineon
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Voltage-Nom |
|
3.3 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare ATECC608B-TNGTLSS-G with alternatives
Compare SLS32AIA010I2USON10XTMA2 with alternatives