ATECC608B-TCSMU
vs
ATECC608B-TNGLORAU-C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
UDFN-8
UDFN-8
Reach Compliance Code
compliant
compliant
Clock Frequency-Max
1 MHz
1 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
Length
3 mm
3 mm
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
HVSON
Package Equivalence Code
SOLCC8,.12,20
SOLCC8,.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max
0.6 mm
0.6 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
2 mm
2 mm
uPs/uCs/Peripheral ICs Type
CRYPTOGRAPHIC AUTHENTICATOR
CRYPTOGRAPHIC AUTHENTICATOR
Base Number Matches
1
1
Compare ATECC608B-TCSMU with alternatives
Compare ATECC608B-TNGLORAU-C with alternatives