AT91SAM9CN12B-CUR
vs
AT91SAM9CN12-CU
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ATMEL CORP
MICROCHIP TECHNOLOGY INC
Package Description
LFBGA,
BGA-217
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
26
26
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
20 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B217
S-PBGA-B217
JESD-609 Code
e8
Length
15 mm
15 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
217
217
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.4 mm
1.4 mm
Speed
400 MHz
400 MHz
Supply Voltage-Max
1.1 V
1.1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
1
Date Of Intro
2017-10-02
Samacsys Manufacturer
Microchip
Bit Size
32
Number of DMA Channels
8
Number of External Interrupts
2
Number of Serial I/Os
2
On Chip Data RAM Width
8
Package Equivalence Code
BGA217,17X17,32
RAM (words)
32768
Screening Level
TS 16949
Compare AT91SAM9CN12B-CUR with alternatives
Compare AT91SAM9CN12-CU with alternatives