AT91SAM9261SB-CU
vs
P80C52UBPN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
NXP SEMICONDUCTORS
Part Package Code
BGA
DIP
Package Description
ROHS COMPLIANT, MO-205, LFBGA-217
DIP, DIP40,.6
Pin Count
217
40
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
NO
Address Bus Width
26
16
Bit Size
32
8
CPU Family
ARM9
8051
Clock Frequency-Max
50 MHz
33 MHz
DAC Channels
YES
NO
DMA Channels
YES
NO
External Data Bus Width
32
8
JESD-30 Code
S-PBGA-B217
R-PDIP-T40
JESD-609 Code
e1
Length
15 mm
52 mm
Number of I/O Lines
93
32
Number of Terminals
217
40
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
DIP
Package Equivalence Code
BGA217,17X17,32
DIP40,.6
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
16384
256
ROM (words)
32768
8192
ROM Programmability
FLASH
MROM
Seated Height-Max
1.4 mm
4.7 mm
Speed
66 MHz
33 MHz
Supply Voltage-Max
1.32 V
5.5 V
Supply Voltage-Min
1.2 V
5 V
Supply Voltage-Nom
1.2 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
THROUGH-HOLE
Terminal Pitch
0.8 mm
2.54 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
15 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER
Base Number Matches
1
2
Supply Current-Max
30.8 mA
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