AT91SAM7XC128B-CU
vs
ATSAM3S1CB-CU
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
GREEN, TFBGA-100
|
TFBGA, BGA100,10X10,32
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
|
24
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
50 MHz
|
20 MHz
|
| DAC Channels |
NO
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
8
|
| JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
| Length |
9 mm
|
9 mm
|
| Number of I/O Lines |
62
|
79
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Speed |
55 MHz
|
64 MHz
|
| Supply Voltage-Max |
1.95 V
|
1.95 V
|
| Supply Voltage-Min |
1.65 V
|
1.62 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Microchip
|
| CPU Family |
|
CORTEX-M3
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| On Chip Program ROM Width |
|
32
|
| Package Equivalence Code |
|
BGA100,10X10,32
|
| Peak Reflow Temperature (Cel) |
|
260
|
| RAM (bytes) |
|
16384
|
| ROM (words) |
|
16384
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare AT91SAM7XC128B-CU with alternatives
Compare ATSAM3S1CB-CU with alternatives