AT91SAM7X256C-AU
vs
ATSAM3S1CB-CU
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ATMEL CORP
ATMEL CORP
Part Package Code
QFP
BGA
Package Description
GREEN, MS-026, LQFP-100
TFBGA, BGA100,10X10,32
Pin Count
100
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
24
Bit Size
32
32
CPU Family
ARM7
CORTEX-M3
Clock Frequency-Max
50 MHz
20 MHz
DAC Channels
NO
YES
DMA Channels
YES
YES
External Data Bus Width
8
JESD-30 Code
S-PQFP-G100
S-PBGA-B100
Length
14 mm
9 mm
Number of I/O Lines
62
79
Number of Terminals
100
100
On Chip Program ROM Width
32
32
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
TFBGA
Package Equivalence Code
QFP100,.63SQ,20
BGA100,10X10,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
65536
16384
ROM (words)
65536
16384
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.1 mm
Speed
55 MHz
64 MHz
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.65 V
1.62 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Width
14 mm
9 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
2
Pbfree Code
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
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Compare ATSAM3S1CB-CU with alternatives