AT91SAM7S128-AU-999
vs
ATSAM3S1CB-CU
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ATMEL CORP
ATMEL CORP
Part Package Code
QFP
BGA
Package Description
GREEN, LQFP-64
TFBGA, BGA100,10X10,32
Pin Count
64
100
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
24
Bit Size
32
32
Clock Frequency-Max
50 MHz
20 MHz
DAC Channels
NO
YES
DMA Channels
YES
YES
External Data Bus Width
8
JESD-30 Code
S-PQFP-G64
S-PBGA-B100
Length
10 mm
9 mm
Number of I/O Lines
32
79
Number of Terminals
64
100
On Chip Program ROM Width
8
32
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
TFBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
ROM (words)
131072
16384
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.1 mm
Speed
55 MHz
64 MHz
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.8 V
1.62 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Width
10 mm
9 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
2
Pbfree Code
Rohs Code
CPU Family
CORTEX-M3
JESD-609 Code
e1
Moisture Sensitivity Level
3
Package Equivalence Code
BGA100,10X10,32
Peak Reflow Temperature (Cel)
260
RAM (bytes)
16384
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
Compare AT91SAM7S128-AU-999 with alternatives
Compare ATSAM3S1CB-CU with alternatives