AT89S51-24AU vs P89C54UBPN feature comparison

AT89S51-24AU Atmel Corporation

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P89C54UBPN Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP PHILIPS SEMICONDUCTORS
Part Package Code QFP
Package Description 10 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, MS-026ACB, TQFP-44 DIP, DIP40,.6
Pin Count 44
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Core Architecture 8051
Device Core 8051
Clock Speed 24
Ram 0.125
Flash Memory 4
Has ADC NO
Address Bus Width 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 33 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 8
JESD-30 Code S-PQFP-G44 R-PDIP-T40
JESD-609 Code e3 e0
Length 10 mm
Moisture Sensitivity Level 3
Number of I/O Lines 32
Number of Terminals 44 40
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP DIP
Package Equivalence Code TQFP44,.47SQ,32 DIP40,.6
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, THIN PROFILE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 128 256
ROM (words) 4096 16384
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm
Speed 24 MHz 33 MHz
Supply Current-Max 25 mA 49.7 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Base Number Matches 2 2

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