AT89C5131-PLSEM
vs
AT89C5131-S3SIM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
ATMEL CORP
Part Package Code
DFN
LCC
Package Description
MLF-48
PLASTIC, LCC-52
Pin Count
48
52
Manufacturer Package Code
MLF
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Category CO2 Kg
11.6
11.6
Compliance Temperature Grade
Industrial: -40C to +85C
Industrial: -40C to +85C
Candidate List Date
2011-06-20
2016-06-20
Has ADC
NO
NO
Address Bus Width
16
16
Bit Size
8
8
CPU Family
8051
8051
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
S-XQCC-N48
S-PQCC-J52
JESD-609 Code
e0
e0
Length
7 mm
19.05 mm
Number of I/O Lines
34
34
Number of Terminals
48
52
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VQCCN
QCCJ
Package Equivalence Code
LCC48,.27SQ,20
LDCC52,.8SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
1280
1280
ROM (words)
32768
32768
ROM Programmability
FLASH
FLASH
Seated Height-Max
0.9 mm
4.57 mm
Speed
40 MHz
40 MHz
Supply Current-Max
31 mA
31 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
5 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
J BEND
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
7 mm
19.05 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
225
Compare AT89C5131-PLSEM with alternatives
Compare AT89C5131-S3SIM with alternatives