AT88SC0808CA-WI88SC0808
vs
AT88SC0104CA-MJ88SC0104
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
WAFER
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Memory Density |
1024 bit
|
1024 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Words |
128 words
|
128 words
|
| Number of Words Code |
128
|
128
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128X8
|
128X8
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Base Number Matches |
2
|
2
|
| JESD-30 Code |
|
R-XQMA-N
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
DIMM
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
MICROELECTRONIC ASSEMBLY
|
| Surface Mount |
|
YES
|
| Terminal Form |
|
NO LEAD
|
| Terminal Position |
|
QUAD
|
|
|
|
Compare AT88SC0808CA-WI88SC0808 with alternatives
Compare AT88SC0104CA-MJ88SC0104 with alternatives