AT88SC0404CA-WI88SC0404
vs
AT88SC0404CA-WI
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
WAFER
|
DIE,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512X8
|
512X8
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
WAFER
|
| JESD-30 Code |
|
R-XUUC-N8
|
| Number of Terminals |
|
8
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
DIE
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
UNCASED CHIP
|
| Surface Mount |
|
YES
|
| Terminal Form |
|
NO LEAD
|
| Terminal Position |
|
UPPER
|
|
|
|
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