AT88SC0404C-WI
vs
AT88SC0404C-PI
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
WAFER
|
|
| Package Description |
DIE,
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| JESD-30 Code |
X-XUUC-N
|
R-PDIP-T8
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
CRYPTO MEMORY
|
| Memory Width |
1
|
8
|
| Number of Functions |
1
|
1
|
| Number of Words |
4096 words
|
512 words
|
| Number of Words Code |
4000
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
4KX1
|
512X8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
DIP
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Length |
|
9.271 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
8
|
| Package Equivalence Code |
|
DIP8,.3
|
| Seated Height-Max |
|
5.334 mm
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
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