AT80C51RD2-3CSUL
vs
87C52/BQA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Not Recommended
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
PHILIPS SEMICONDUCTORS
Package Description
GREEN, PLASTIC, DIP-40
DIP, DIP40,.6
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
Address Bus Width
16
Bit Size
8
8
Boundary Scan
NO
Clock Frequency-Max
30 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
8
JESD-30 Code
R-PDIP-T40
R-CDIP-T40
Length
51.75 mm
Number of I/O Lines
32
Number of Terminals
40
40
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
ROM (words)
0
8192
ROM Programmability
ROM LESS
UVPROM
Seated Height-Max
5.08 mm
Speed
30 MHz
12 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
2
4
Rohs Code
CPU Family
8051
JESD-609 Code
e0
Package Equivalence Code
DIP40,.6
RAM (bytes)
256
Screening Level
38535Q/M;38534H;883B
Supply Current-Max
35 mA
Terminal Finish
Tin/Lead (Sn/Pb)
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