AT75C221-C256 vs MPC875VR133 feature comparison

AT75C221-C256 Atmel Corporation

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MPC875VR133 Freescale Semiconductor

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA256,20X20,50 LEAD FREE, PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 16 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 24 mm 23 mm
Low Power Mode NO YES
Number of Terminals 256 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Equivalence Code BGA256,20X20,50 BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.34 mm 2.54 mm
Speed 40 MHz 133 MHz
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 24 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
ECCN Code 5A002
Samacsys Manufacturer NXP
Integrated Cache YES
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
Time@Peak Reflow Temperature-Max (s) 30

Compare AT75C221-C256 with alternatives

Compare MPC875VR133 with alternatives