AT75C221-C256 vs 79RC32T365180BC feature comparison

AT75C221-C256 Atmel Corporation

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79RC32T365180BC Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA256,20X20,50 17 X 17 MM, MO-192, CABGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 16 MHz 90 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 24 mm 17 mm
Low Power Mode NO YES
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,20X20,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.34 mm 1.7 mm
Speed 40 MHz 180 MHz
Supply Voltage-Nom 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 24 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
ECCN Code 3A991.A.2
Integrated Cache YES
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Time@Peak Reflow Temperature-Max (s) 20

Compare AT75C221-C256 with alternatives

Compare 79RC32T365180BC with alternatives