AT75C221-C256
vs
79RC32T365180BC
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
ATMEL CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA256,20X20,50
|
17 X 17 MM, MO-192, CABGA-256
|
Pin Count |
256
|
256
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
16 MHz
|
90 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e0
|
Length |
24 mm
|
17 mm
|
Low Power Mode |
NO
|
YES
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA256,20X20,50
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.34 mm
|
1.7 mm
|
Speed |
40 MHz
|
180 MHz
|
Supply Voltage-Nom |
1.8 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
24 mm
|
17 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
3A991.A.2
|
Integrated Cache |
|
YES
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
225
|
Supply Voltage-Max |
|
2.625 V
|
Supply Voltage-Min |
|
2.375 V
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare AT75C221-C256 with alternatives
Compare 79RC32T365180BC with alternatives