AT697E-KG-SV
vs
HD6417751VF133
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP, QFP256,2.1SQ,20
|
FQFP, QFP256,1.2SQ,16
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
28
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
100 MHz
|
34 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G256
|
S-PQFP-G256
|
| Length |
37.085 mm
|
28 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
125 °C
|
75 °C
|
| Operating Temperature-Min |
-55 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
FQFP
|
| Package Equivalence Code |
QFP256,2.1SQ,20
|
QFP256,1.2SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535V;38534K;883S
|
|
| Seated Height-Max |
3.18 mm
|
3.95 mm
|
| Speed |
100 MHz
|
133 MHz
|
| Supply Voltage-Max |
1.95 V
|
1.6 V
|
| Supply Voltage-Min |
1.65 V
|
1.4 V
|
| Supply Voltage-Nom |
1.8 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.508 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
37.085 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e6
|
| Supply Current-Max |
|
470 mA
|
| Terminal Finish |
|
TIN BISMUTH
|
|
|
|
Compare AT697E-KG-SV with alternatives
Compare HD6417751VF133 with alternatives