AT68166F-YS20-E
vs
MSM832TLMB-10
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
MOSAIC SEMICONDUCTOR INC
|
| Part Package Code |
QFP
|
DIP
|
| Package Description |
QFF,
|
,
|
| Pin Count |
68
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
20 ns
|
100 ns
|
| Additional Feature |
IT CAN BE USED AS 2BANK OF 512K X 16 OR 4BANK OF 512K X 8 ALSO
|
|
| JESD-30 Code |
S-CQFP-F68
|
R-CDIP-T28
|
| Length |
24.13 mm
|
|
| Memory Density |
16777216 bit
|
262144 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
32
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
28
|
| Number of Words |
524288 words
|
32768 words
|
| Number of Words Code |
512000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
512KX32
|
32KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
24.13 mm
|
|
| Base Number Matches |
2
|
2
|
| Number of Ports |
|
1
|
| Output Enable |
|
YES
|
| Screening Level |
|
MIL-STD-883
|
| Standby Voltage-Min |
|
2 V
|
|
|
|
Compare AT68166F-YS20-E with alternatives
Compare MSM832TLMB-10 with alternatives