AT68166F-YS20-E
vs
WS128K32L-25G1UMA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
WHITE ELECTRONIC DESIGNS CORP
Package Description
0.950 INCH, CERAMIC, MQFP-68
23.90 MM, 3.57 MM HEIGHT, CERAMIC, QFP-68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
25 ns
Additional Feature
IT CAN BE USED AS 2BANK OF 512K X 16 OR 4BANK OF 512K X 8 ALSO
USER CONFIGURABLE AS 512K X 8
JESD-30 Code
S-CQFP-F68
S-CQFP-G68
Length
24.13 mm
23.88 mm
Memory Density
16777216 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
524288 words
131072 words
Number of Words Code
512000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX32
128KX32
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFF
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.7 mm
3.56 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
24.13 mm
23.88 mm
Base Number Matches
1
1
Rohs Code
Alternate Memory Width
16
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
QFP68,.99SQ,50
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Standby Current-Max
0.002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.6 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AT68166F-YS20-E with alternatives
Compare WS128K32L-25G1UMA with alternatives