AT52BR1672-85CI
vs
M36W416TG85ZA1
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NUMONYX
|
Package Description |
10 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, CBGA-66
|
LFBGA,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
85 ns
|
|
Additional Feature |
ALSO CONTAINS 128K X 16 SRAM
|
STATIC RAM ORGANISED AS 256K X 16
|
JESD-30 Code |
R-PBGA-B66
|
R-PBGA-B66
|
JESD-609 Code |
e0
|
|
Length |
10 mm
|
12 mm
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
16
|
Mixed Memory Type |
FLASH+SRAM
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
66
|
66
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
1MX16
|
1MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
LFBGA
|
Package Equivalence Code |
BGA66,8X12,32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.4 mm
|
Supply Current-Max |
0.045 mA
|
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
66
|
|
|
|
Compare AT52BR1672-85CI with alternatives
Compare M36W416TG85ZA1 with alternatives