AT52BR1664-70CI
vs
M36W832BE70ZA1T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Package Description
10 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, CBGA-66
12 X 8 MM, 0.80 MM PITCH, LFBGA-66
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
70 ns
Additional Feature
ALSO CONTAINS 256K X 16 SRAM
SRAM IS ORGANISED AS 512K X 16
JESD-30 Code
R-PBGA-B66
R-PBGA-B66
Length
10 mm
12 mm
Memory Density
16777216 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA66,8X12,32
BGA66,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Supply Current-Max
0.045 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.3 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
66
JESD-609 Code
e0
Standby Current-Max
0.00002 A
Terminal Finish
TIN LEAD
Compare AT52BR1664-70CI with alternatives
Compare M36W832BE70ZA1T with alternatives