AT45DB081B-CC-2.5
vs
AT45DB081B-CU
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
4.50 X 7 MM, 1.40 MM HEIGHT, 1 MM PITCH, PLASTIC, CBGA-14
|
4.50 X 7 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, PLASTIC, CBGA-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
ORGANIZED AS 4096 PAGES OF 264 BYTES EACH
|
|
| Clock Frequency-Max (fCLK) |
15 MHz
|
20 MHz
|
| JESD-30 Code |
R-PBGA-B14
|
R-PBGA-B14
|
| JESD-609 Code |
e0
|
e1
|
| Length |
7 mm
|
7 mm
|
| Memory Density |
8650752 bit
|
8650752 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Number of Words |
1081344 words
|
1081344 words
|
| Number of Words Code |
1081344
|
1081344
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1081344X8
|
1081344X8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA14,3X5,40
|
BGA14,3X5,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
2.7 V
|
2.7 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Serial Bus Type |
SPI
|
SPI
|
| Standby Current-Max |
0.00001 A
|
0.00001 A
|
| Supply Current-Max |
0.035 mA
|
0.035 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
4.5 mm
|
4.5 mm
|
| Write Protection |
HARDWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare AT45DB081B-CC-2.5 with alternatives
Compare AT45DB081B-CU with alternatives