AT45DB021E-MHN2B-T
vs
XC17256EPD8C
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ADESTO TECHNOLOGIES CORP
|
XILINX INC
|
| Part Package Code |
SON
|
DIP
|
| Package Description |
5 X 6 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8
|
PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Samacsys Manufacturer |
Adesto Technologies
|
|
| Clock Frequency-Max (fCLK) |
70 MHz
|
15 MHz
|
| Data Retention Time-Min |
20
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDIP-T8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
6 mm
|
9.3599 mm
|
| Memory Density |
2097152 bit
|
262144 bit
|
| Memory IC Type |
FLASH
|
CONFIGURATION MEMORY
|
| Memory Width |
1
|
1
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2097152 words
|
262144 words
|
| Number of Words Code |
2000000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2MX1
|
256KX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
DIP
|
| Package Equivalence Code |
SOLCC8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
2.7 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.6 mm
|
4.5974 mm
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.000008 A
|
0.00005 A
|
| Supply Current-Max |
0.016 mA
|
0.01 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
|
| Width |
5 mm
|
7.62 mm
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
| I/O Type |
|
COMMON
|
| Output Characteristics |
|
3-STATE
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AT45DB021E-MHN2B-T with alternatives
Compare XC17256EPD8C with alternatives