AT45DB021B-CL
vs
AT45DB021D-SSH-T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ATMEL CORP
DIALOG SEMICONDUCTOR GMBH
Part Package Code
BGA
Package Description
5 X 5 MM, 1.20 MM HEIGHT, 1 MM PITCH, PLASTIC, CBGA-9
0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8
Pin Count
9
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Additional Feature
ORGANIZED AS 1024 PAGES OF 264 BYTES EACH
Clock Frequency-Max (fCLK)
20 MHz
66 MHz
JESD-30 Code
S-PBGA-B9
R-PDSO-G8
JESD-609 Code
e1
e4
Length
5 mm
4.925 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
1
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
9
8
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX1
2MX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
SOP
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
NICKEL PALLADIUM GOLD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
Width
5 mm
3.9 mm
Base Number Matches
1
4
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