AT30TS74-UFM14-T-072
vs
TMP1075DSGR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
BGA4,2X2,16
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Factory Lead Time |
12 Weeks
|
|
Date Of Intro |
2017-02-24
|
2018-12-23
|
Samacsys Manufacturer |
Microchip
|
Texas Instruments
|
Accuracy-Max (Cel) |
3 Cel
|
1 Cel
|
Body Height |
0.499 mm
|
0.8 mm
|
Housing |
PLASTIC
|
PLASTIC
|
JESD-609 Code |
e1
|
e4
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Bits |
12
|
12
|
Number of Terminals |
4
|
8
|
Operating Current-Max |
0.8 mA
|
0.004 mA
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Equivalence Code |
BGA4,2X2,16
|
|
Package Shape/Style |
RECTANGULAR
|
SQUARE
|
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
1.7 V
|
1.7 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
NICKEL PALLADIUM GOLD
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Body Breadth |
|
2 mm
|
Body Length or Diameter |
|
2 mm
|
|
|
|
Compare AT30TS74-UFM14-T-072 with alternatives
Compare TMP1075DSGR with alternatives