AT28HC256-12SU
vs
X68257D
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
XICOR INC
Reach Compliance Code
compliant
unknown
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Access Time-Max
120 ns
120 ns
Additional Feature
AUTOMATIC WRITE
Command User Interface
NO
Data Polling
YES
Endurance
10000 Write/Erase Cycles
JESD-30 Code
R-PDSO-G28
R-GDIP-T28
JESD-609 Code
e3
Length
17.9 mm
37.15 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP28,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Page Size
64 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
2.65 mm
5.9 mm
Standby Current-Max
0.0003 A
Supply Current-Max
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Toggle Bit
YES
Width
7.5 mm
15.24 mm
Write Cycle Time-Max (tWC)
10 ms
Base Number Matches
2
1
Package Description
HERMETIC SEALED, CERDIP-28
Compare AT28HC256-12SU with alternatives
Compare X68257D with alternatives