AT28C256E-25UM/883-815
vs
AT28C256E-25JI
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
PGA-28
|
QCCJ, LDCC32,.5X.6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Factory Lead Time |
23 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Access Time-Max |
250 ns
|
250 ns
|
| Additional Feature |
AUTOMATIC WRITE
|
AUTOMATIC WRITE
|
| Command User Interface |
NO
|
NO
|
| Data Polling |
YES
|
YES
|
| Data Retention Time-Min |
10
|
|
| Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
R-CPGA-P28
|
R-PQCC-J32
|
| Length |
16.51 mm
|
13.97 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
28
|
32
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
PGA
|
QCCJ
|
| Package Equivalence Code |
PGA28,5X6
|
LDCC32,.5X.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER
|
| Page Size |
64 words
|
64 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
225
|
| Programming Voltage |
5 V
|
5 V
|
| Screening Level |
MIL-STD-883 Class B
|
MIL-STD-883
|
| Seated Height-Max |
4.4 mm
|
3.556 mm
|
| Standby Current-Max |
0.0003 A
|
0.0002 A
|
| Supply Current-Max |
0.05 mA
|
0.05 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
PIN/PEG
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Toggle Bit |
YES
|
YES
|
| Width |
13.97 mm
|
11.43 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFJ
|
| Pin Count |
|
32
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
2
|
| Output Characteristics |
|
3-STATE
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare AT28C256E-25UM/883-815 with alternatives
Compare AT28C256E-25JI with alternatives