AT27LV020A-12TC
vs
AT27LV020A-12CC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
ATMEL CORP
Part Package Code
TSOP1
BGA
Package Description
8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32
LBGA, BGA42,6X7,40
Pin Count
32
42
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
120 ns
120 ns
Additional Feature
ALSO OPERATES AT 5V SUPPLY
ALSO OPERATES AT 5V SUPPLY
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G32
S-PBGA-B42
JESD-609 Code
e0
e0
Length
18.4 mm
8 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
32
42
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX8
256KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
LBGA
Package Equivalence Code
TSSOP32,.8,20
BGA42,6X7,40
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Standby Current-Max
0.00002 A
0.00002 A
Supply Current-Max
0.025 mA
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
DUAL
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
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