AT27LV010A-12TC
vs
AM27H010-55DEB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
ADVANCED MICRO DEVICES INC
Part Package Code
TSOP1
DIP
Package Description
8 X 20 MM, PLASTIC, MO-142BD, TSOP-32
WDIP, DIP32,.6
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
120 ns
55 ns
Additional Feature
CAN ALSO BE OPERATED AT 4.5V TO 5.5V RANGE
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G32
R-GDIP-T32
JESD-609 Code
e0
e0
Length
18.4 mm
42.1005 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
TSOP1
WDIP
Package Equivalence Code
TSSOP32,.8,20
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
5.588 mm
Standby Current-Max
0.00001 A
0.035 A
Supply Current-Max
0.025 mA
0.06 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
8 mm
15.24 mm
Base Number Matches
1
1
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Compare AM27H010-55DEB with alternatives