AT27HC256-12JI vs TMS27PC256-12FME feature comparison

AT27HC256-12JI Microchip Technology Inc

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TMS27PC256-12FME Texas Instruments

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Rohs Code No No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TEXAS INSTRUMENTS INC
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 120 ns 120 ns
I/O Type COMMON COMMON
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Moisture Sensitivity Level 2
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC32,.5X.6 LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Programming Voltage 12.5 V 13 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.045 A 0.00025 A
Supply Current-Max 0.09 mA 0.03 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 2 1
Pbfree Code No
Package Description QCCJ, LDCC32,.5X.6
Length 13.97 mm
Number of Functions 1
Operating Mode ASYNCHRONOUS
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 3.56 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm

Compare AT27HC256-12JI with alternatives

Compare TMS27PC256-12FME with alternatives