AT27HC1024-70DM/883
vs
AM27C1024-70DI
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ATMEL CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
WDIP, DIP40,.6
|
|
| Pin Count |
40
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.61
|
|
| Access Time-Max |
70 ns
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-GDIP-T40
|
|
| JESD-609 Code |
e0
|
|
| Length |
52.45 mm
|
|
| Memory Density |
1048576 bit
|
|
| Memory IC Type |
UVPROM
|
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
40
|
|
| Number of Words |
65536 words
|
|
| Number of Words Code |
64000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
64KX16
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
WDIP
|
|
| Package Equivalence Code |
DIP40,.6
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE, WINDOW
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
5.72 mm
|
|
| Standby Current-Max |
0.01 A
|
|
| Supply Current-Max |
0.09 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
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