AT27BV010-70JIT/R vs AT27BV010-70TI feature comparison

AT27BV010-70JIT/R Microchip Technology Inc

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AT27BV010-70TI Atmel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ATMEL CORP
Package Description PLASTIC, LCC-32 TSOP1, TSSOP32,.8,20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 70 ns
Additional Feature UNREGULATED BATTERY POWER SUPPLY RANGE IT CAN ALSO OPERATE WITH 5V SUPPLY
JESD-30 Code R-PQCC-J32 R-PDSO-G32
JESD-609 Code e0 e0
Length 13.97 mm 18.4 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Moisture Sensitivity Level 2 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.55 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD DUAL
Width 11.43 mm 8 mm
Base Number Matches 2 1
Pbfree Code No
Part Package Code TSOP1
Pin Count 32
I/O Type COMMON
Package Equivalence Code TSSOP32,.8,20
Peak Reflow Temperature (Cel) 240
Standby Current-Max 0.00002 A
Supply Current-Max 0.025 mA

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