AT25HP512-10PU-1.8
vs
AT25HP512-10PJ-1.8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
Package Description
0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8
0.300 INCH, PLASTIC, MS-001BA, DIP-8
Pin Count
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
2 MHz
2 MHz
Data Retention Time-Min
40
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
9.271 mm
9.271 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX8
64KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
5.334 mm
Serial Bus Type
SPI
SPI
Standby Current-Max
0.000002 A
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.7 V
2.7 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AT25HP512-10PU-1.8 with alternatives
Compare AT25HP512-10PJ-1.8 with alternatives