AT25HP512-10PI-1.8
vs
AT25HP512-10PJ-1.8
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
DIP-8
|
0.300 INCH, PLASTIC, MS-001BA, DIP-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
2.7V TO 5.5V @ 5MHz AND 1.8V TO 5.5V @ 2MHz
|
|
| Clock Frequency-Max (fCLK) |
10 MHz
|
2 MHz
|
| Data Retention Time-Min |
40
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| Length |
9.271 mm
|
9.271 mm
|
| Memory Density |
524288 bit
|
524288 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
64KX8
|
64KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
5 V
|
|
| Seated Height-Max |
5.334 mm
|
5.334 mm
|
| Serial Bus Type |
SPI
|
SPI
|
| Standby Current-Max |
0.000005 A
|
|
| Supply Current-Max |
0.01 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.7 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AT25HP512-10PJ-1.8 with alternatives