AT25HP256W-10SJ-1.8
vs
M24C32-FMN6TG/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ATMEL CORP
STMICROELECTRONICS
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Clock Frequency-Max (fCLK)
2 MHz
0.4 MHz
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e4
Length
5.29 mm
4.9 mm
Memory Density
262144 bit
32768 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
32768 words
4096 words
Number of Words Code
32000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX8
4KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.16 mm
1.75 mm
Serial Bus Type
SPI
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.7 V
Supply Voltage-Nom (Vsup)
2.7 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
5.24 mm
3.9 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
1
2
Moisture Sensitivity Level
1
Compare AT25HP256W-10SJ-1.8 with alternatives
Compare M24C32-FMN6TG/P with alternatives