AT25320B-MAPDGV-E vs IS25C32B-2PLI feature comparison

AT25320B-MAPDGV-E Atmel Corporation

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IS25C32B-2PLI Integrated Silicon Solution Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ATMEL CORP INTEGRATED SILICON SOLUTION INC
Package Description HVSON, DIP,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-N8 R-PDIP-T8
Length 3 mm 9.27 mm
Memory Density 32768 bit 32768 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4KX8 4KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Parallel/Serial SERIAL SERIAL
Screening Level AEC-Q100
Seated Height-Max 0.6 mm 4.2 mm
Serial Bus Type SPI SPI
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 1.8 V
Supply Voltage-Nom (Vsup) 5 V 2.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Width 2 mm 7.62 mm
Base Number Matches 2 1
Rohs Code Yes
Part Package Code DIP
Pin Count 8
Clock Frequency-Max (fCLK) 5 MHz
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 10
Write Cycle Time-Max (tWC) 5 ms

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