AT24HC04B-PU
vs
AT24C16D-MAHM-T
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
0.300 INCH, LEAD AND HALOGEN FREE, PLASTIC, MS-001BA, DIP-8
|
UDFN-8
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
6 Weeks
|
11 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Additional Feature |
ALSO OPERATES AT 1.8V TO 5.5V @ 0.4MHZ
|
ALSO OPERATES 1.7V AT 100 KHZ STD MODE AND 400 KHZ @ FAST MODE
|
Clock Frequency-Max (fCLK) |
1 MHz
|
1 MHz
|
Data Retention Time-Min |
100
|
100
|
Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
I2C Control Byte |
1010DDDR
|
1010MMMR
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-N8
|
JESD-609 Code |
e3
|
e4
|
Length |
9.271 mm
|
3 mm
|
Memory Density |
4096 bit
|
16384 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
512 words
|
2048 words
|
Number of Words Code |
512
|
2000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512X8
|
2KX8
|
Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
HVSON
|
Package Equivalence Code |
DIP8,.3
|
SOLCC8,.12,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Programming Voltage |
5 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
5.334 mm
|
0.6 mm
|
Serial Bus Type |
I2C
|
I2C
|
Standby Current-Max |
0.000018 A
|
8e-7 A
|
Supply Current-Max |
0.003 mA
|
0.001 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
2 mm
|
Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
Write Protection |
HARDWARE
|
HARDWARE
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
Date Of Intro |
|
2016-12-08
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare AT24HC04B-PU with alternatives
Compare AT24C16D-MAHM-T with alternatives