AT24C64D-U2UM0B-T
vs
AT24C64D-MAHM-E
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ATMEL CORP
|
| Package Description |
0.40 MM PITCH, GREEN, WLCSP-4
|
HVSON,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
ALSO OPERATES 1.7V AT 400 KHZ
|
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
1 MHz
|
| JESD-30 Code |
X-PBGA-B4
|
R-PDSO-N8
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
8
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVSON
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
0.33 mm
|
0.6 mm
|
| Serial Bus Type |
I2C
|
I2C
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Write Cycle Time-Max (tWC) |
5 ms
|
5 ms
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
Microchip
|
| Length |
|
3 mm
|
| Width |
|
2 mm
|
|
|
|
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