AT24C02CU3-CUM-T
vs
M95M02-DRCS6G
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
STMICROELECTRONICS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
VFBGA,
|
HALOGEN FREE AND ROHS COMPLIANT, WLCSP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.B.1.B.1
|
3A991.B.1.B.1
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Additional Feature |
100 YEAR DATA RETENTION
|
|
Clock Frequency-Max (fCLK) |
1 MHz
|
5 MHz
|
Data Retention Time-Min |
100
|
40
|
Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
I2C Control Byte |
1010DDDR
|
|
JESD-30 Code |
R-PBGA-B8
|
R-PBGA-B8
|
JESD-609 Code |
e3
|
|
Length |
2 mm
|
3.556 mm
|
Memory Density |
2097152 bit
|
2097152 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
256KX8
|
256KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.85 mm
|
0.325 mm
|
Serial Bus Type |
I2C
|
SPI
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
1.5 mm
|
2.011 mm
|
Write Cycle Time-Max (tWC) |
5 ms
|
10 ms
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Package Equivalence Code |
|
BGA8(UNSPEC)
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Standby Current-Max |
|
0.000003 A
|
Supply Current-Max |
|
0.003 mA
|
Supply Voltage-Nom (Vsup) |
|
2.5 V
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare AT24C02CU3-CUM-T with alternatives
Compare M95M02-DRCS6G with alternatives