AT22LV10-30JI
vs
ATF22LV10CQZ-30PJ
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
Part Package Code |
LCC
|
DIP
|
Package Description |
QCCJ, LDCC28,.5SQ
|
DIP,
|
Pin Count |
28
|
24
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
|
|
Architecture |
PAL-TYPE
|
|
Clock Frequency-Max |
28.5 MHz
|
25 MHz
|
JESD-30 Code |
S-PQCC-J28
|
R-PDIP-T24
|
JESD-609 Code |
e0
|
e3
|
Length |
11.5062 mm
|
31.887 mm
|
Moisture Sensitivity Level |
2
|
1
|
Number of Dedicated Inputs |
11
|
11
|
Number of I/O Lines |
10
|
10
|
Number of Inputs |
22
|
|
Number of Outputs |
10
|
|
Number of Product Terms |
132
|
|
Number of Terminals |
28
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
11 DEDICATED INPUTS, 10 I/O
|
11 DEDICATED INPUTS, 10 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC28,.5SQ
|
DIP24,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
225
|
245
|
Programmable Logic Type |
OT PLD
|
FLASH PLD
|
Propagation Delay |
30 ns
|
30 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
5.334 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
5 V
|
3.3 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
11.5062 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare AT22LV10-30JI with alternatives
Compare ATF22LV10CQZ-30PJ with alternatives